BYD Partners with Hangshun HK32 MCU for Market Breakthrough

As the global auto industry accelerates toward electrification, intelligence, and connectivity, in-vehicle infotainment systems have become central to the driving experience. BYD, a leader in new energy vehicles, has partnered with Hangshun Chip, a national-level specialized new enterprise, to apply the HK32 series automotive MCUs in its infotainment systems. This collaboration aims to strengthen supply chain independence and reduce reliance on foreign chips, setting a model for domestic chip adoption in the automotive sector.

How Hangshun HK32 MCU Empowers BYD

Reliability: Stable Operation in Extreme Conditions

The HK32 automotive MCU operates from -40°C to +125°C, with strong electromagnetic interference resistance and ESD protection. It meets AEC-Q100 Grade1 standards and ensures over 15 years of lifespan, guaranteeing long-term stability for BYD's infotainment systems.

Performance: Millisecond Response

With ARM Cortex-M0/M3/M4 cores and up to 168MHz clock speed, the HK32 MCU handles key tasks like button processing, power management, and audio control in milliseconds, delivering smooth touchscreen and audio experiences.

Cost Efficiency: High Value at Lower Cost

As a domestic chip, the HK32 MCU offers significant cost advantages over imported equivalents, reducing overall system costs and enabling BYD to provide rich features at competitive prices.

Ecosystem: Rich Interfaces for Fast Iteration

The HK32 MCU supports CAN-FD, UART, SPI, I2C, SAI, and other interfaces, simplifying peripheral integration. Hangshun provides a complete development toolchain and technical support, accelerating product development cycles.

Solution Overview

The BYD infotainment system based on Hangshun HK32 MCU adopts a layered architecture with the HK32 as the control core. It handles button input, power management, audio signal control, peripheral expansion, and system monitoring. The solution is deployed in BYD's Dynasty and Ocean series models, supporting features like multi-function steering wheel controls, touch input, immersive audio, and over-the-air updates.

Key Advantages

  • Automotive-Grade Quality: AEC-Q100 Grade1 certified, robust against harsh environments.
  • High Performance: Fast startup and real-time response for complex tasks.
  • High Integration: Reduces external components, simplifying design and lowering cost.
  • Scalability: Modular design adapts to different vehicle models and configurations.
  • Supply Chain Security: Fully domestic production eliminates import dependency.

This partnership exemplifies the synergy between China's automotive and semiconductor industries. With the HK32 MCU, BYD enhances product competitiveness and promotes the industrialization of domestic chips. Future collaboration will extend to more automotive electronics for smarter, safer, and more comfortable travel.

Hangshun Chip Product Portfolio

Hangshun offers over 300 MCU variants based on ARM Cortex-M0/M3/M4 and RISC-V cores, including ultra-low-cost and high-performance families. Notable series include:

  • HK32F001: Cortex-M0, 24MHz, 24KB Flash, for ultra-cost-sensitive applications.
  • HK32F403: Cortex-M4 with DSP, 108MHz, 128KB Flash, for industrial and automotive.
  • HK32F401: Cortex-M4, 72MHz, 64KB Flash, cost-effective for consumer electronics.
  • HK32F005: World's smallest 1mm² 32-bit MCU, Cortex-M0, 48MHz, 32KB Flash.
  • HK32L010: Ultra-low-power, Cortex-M0, 48MHz, 64KB Flash, for wearable and IoT.
  • HK32F407/405/417/415: Cortex-M4F, 168MHz, up to 1MB Flash, for high-end industrial.
  • HK32F103A: Cortex-M3, 120MHz, up to 512KB Flash, high-performance general-purpose.
  • HK16P053/071: 8-bit MCUs for simple control tasks.